Crius & MicroCube
Thermal Imaging Cores
High-resolution uncooled LWIR cores from 640 VGA to 1280 SXGA — engineered for SWaP-optimized integration in defense, surveillance, and critical infrastructure systems.
Two Families. One Proven Platform.
The Crius and MicroCube series represent Exosens' full range of uncooled LWIR thermal imaging cores, sharing the same micro-bolometer technology and 12 µm pixel pitch for consistent performance across form factors.
Crius S 1280 — mechanical shutter variant
Crius LWIR Thermal Cores
1.3-megapixel and VGA uncooled LWIR cores delivering outstanding DRI performance in a compact, low-power design. Standard and Extreme Performance variants available.
Crius 640 Series
Crius 1280 Series
Crius S 1280 Series
SHUTTERED
Crius XP 640 (NEW)
XP
Crius XP 1280 (NEW)
XP
Crius XP S 1280 (NEW)
XP · SHUTTERED
Crius Series — Complete Comparison
All Crius models share the same micro-bolometer sensor, 8–14 µm spectral range, and −40°C to +70°C operating temperature range.
| Specification | Crius 640 | Crius 1280 | Crius S 1280 | Crius XP 640 ⚡ | Crius XP 1280 ⚡ | Crius XP S 1280 ⚡ |
|---|---|---|---|---|---|---|
| Resolution | 640×480 | 1280×1024 | 1280×1024 | 640×480 | 1280×1024 | 1280×1024 |
| Pixel Pitch | 12 µm | 12 µm | 12 µm | 12 µm | 12 µm | 12 µm |
| NETD (max) | <50 or <40 mK | <50 or <40 mK | <50 mK | <20 mK | <20 mK | <20 mK |
| Frame Rates | 9 Hz / 60 Hz | 9 Hz / 60 Hz | 9 Hz / 60 Hz | 9 Hz / 60 Hz | 9 Hz / 60 Hz | Contact Wilco |
| Shutter | Shutterless NUC | Shutterless | Mechanical | Shutterless NUC | Shutterless | Mechanical |
| Startup Time | — | — | — | <0.7 s | <0.7 s | — |
| Size (DF40) | 30×30×23 mm | 35×35×27 mm | 46×47×27 mm | 30×30×23 mm | 35×35×27 mm | 46×47×27 mm |
| Weight (DF40) | <38 g | <90 g | <130 g | <38 g | <90 g | <130 g |
| Power (DF40) | <1.2 W | <2.8 W | <2.8 W | <1.2 W | <2.8 W | <2.8 W |
| Interfaces | CL, SDI, DF40 | CL, SDI, DF40, MIPI | DF40, SDI, MIPI | CL, SDI, DF40 | CL, SDI, DF40, MIPI | DF40, SDI, MIPI |
| Contour Enh. | — | — | — | ✓ | ✓ | ✓ |
| Qualification | Industrial | Industrial | Industrial | MIL-STD-810G | MIL-STD-810G | MIL-STD-810G |
| Image Processing | BPC, NUC, AGC (all models) | |||||
MicroCube LWIR Thermal Cores
The smallest ITAR-free VGA uncooled LWIR thermal core — 22×22 mm footprint, under 25 g. Purpose-built for UAVs, robotics, and all battery-powered, size-critical platforms.
MicroCube 640
MicroCube XP 640 (NEW)
XP
| Specification | MicroCube 640 | MicroCube XP 640 ⚡ |
|---|---|---|
| Resolution | 640×480 px | 640×480 px |
| Pixel Pitch | 12 µm | 12 µm |
| NETD (max) | <50 mK or <40 mK | <20 mK (with denoising) |
| Spectral Range | 8–14 µm | 8–14 µm |
| Frame Rate | 9 Hz / 60 Hz | Contact Wilco |
| Startup Time | — | <0.7 s |
| Size (DF40) | 22×22×26.8 mm | 22×22×26.8 mm |
| Weight (DF40) | <25 g | <25 g |
| Power (DF40) | <1.2 W | <1.2 W |
| Interfaces | MIPI-CSI, DF40, UVC | MIPI-CSI, DF40 |
| Contour Enhancement | — | ✓ |
| Column/Temporal Denoising | — | ✓ |
| Qualification | Industrial (Standard) | MIL-STD-810G |
| Operating Temp | −40°C to +70°C | −40°C to +70°C |
| Image Processing | BPC, NUC, Shutterless NUC, AGC | BPC, NUC, Shutterless NUC, AGC |
Platform-Defining Features
Shared across Crius and MicroCube, these technologies ensure consistent performance from the smallest SWaP to the highest resolution configuration.
Superior DRI Performance
12 µm pixel pitch delivers enhanced Detection, Recognition, and Identification ranges — critical for long-range surveillance, search and rescue, and border monitoring platforms.
XP Extreme Performance
Column and temporal denoising cuts NETD from 40 mK to <20 mK. Contour enhancement sharpens object edges for superior clarity in high-clutter environments. Fast <0.7s startup.
Flexible Interface Options
DF40, Camera Link, SDI, MIPI CSI-2, and UVC interfaces ensure compatibility with virtually any system architecture. Same core performance across multiple integration options.
Advanced Image Processing
On-board Bad Pixel Correction (BPC), Non-Uniformity Correction (NUC), and Automatic Gain Control (AGC) deliver clean imagery without requiring host-side processing overhead.
MIL-STD-810G Qualified (XP)
XP variants are qualified to MIL-STD-810G Method 514 vibration — 10Hz–2kHz at 13.95g per axis for 10 hours per axis — for mission-critical and airborne deployment.
European-Made, ITAR-Free
Manufactured by Xenics, an Exosens company based in Belgium. ITAR-free status enables global export without US export control restrictions — a key advantage for international programs.
Where Crius & MicroCube Excel
From handheld devices to mounted electro-optical systems, these cores serve a broad spectrum of LWIR imaging needs.
UAV / UAS Payloads
Ultra-SWaP MicroCube fits micro and nano UAV gimbal payloads. Crius 640 powers mid-size UAS thermal sensors.
Robotics & UGVs
Low power draw and small footprint make both families ideal for ground robotic platforms and autonomous vehicle vision systems.
Long-Range Surveillance
Crius 1280 SXGA resolution maximizes DRI ranges for border monitoring, perimeter security, and critical infrastructure surveillance.
Search & Rescue
High thermal sensitivity with wide LWIR spectral range enables reliable detection of personnel in all weather and lighting conditions.
Industrial Thermography
Precise temperature sensitivity for predictive maintenance, process monitoring, and non-destructive testing in industrial environments.
Weapon Sight Integration
Compact Crius 640 with DF40 handheld interface option enables integration into clip-on and dedicated thermal weapon sights.
EO System Retrofit
Generic design ensures plug-and-play retrofit into existing electro-optical systems for defense and security platform upgrades.
Handheld Devices
Battery-optimized power envelopes — as low as 1.2 W — support long operational endurance in portable thermal imaging systems.
Product Documentation
Download the official Exosens / Xenics product leaflets for all Crius and MicroCube series.
Ready to Integrate?
Wilco Imaging's team can help you select the right Crius or MicroCube configuration — resolution, NETD tier, interface, and XP vs. standard — for your specific platform and mission requirements.